India Approves Four New Semiconductor Projects Under ISM with INR 4,600 Cr Investment
The Union Cabinet, chaired by Prime Minister Narendra Modi, approved proposals from SiCSem, Continental Device India Private Ltd, 3D Glass Solutions Inc., and Advanced System in Package Technologies for setting up semiconductor manufacturing facilities in Odisha, Punjab and Andhra Pradesh.
August 13, 2025. By Dineshwori
The Union Cabinet, chaired by Prime Minister Narendra Modi, approved proposals from SiCSem, Continental Device India Private Limited (CDIL), 3D Glass Solutions Inc., and Advanced System in Package (ASIP) Technologies for setting up semiconductor manufacturing facilities in Odisha, Punjab, and Andhra Pradesh.
These newly approved projects represent a combined investment of approximately INR 4,600 crore and are expected to generate employment for 2,034 skilled professionals, along with numerous indirect jobs in the electronic manufacturing ecosystem.
With these approvals, the total number of sanctioned semiconductor projects under the ISM has risen to 10, spanning six states, with cumulative investments nearing INR 1.60 lakh crore. The six approved projects are already in various stages of execution.
The four new approved projects are aimed at catering to the growing demand for semiconductors in telecom, automotive, data centers, consumer electronics, and industrial electronics, significantly contribute to making Atmanirbhar Bharat.
SiCSem Private Ltd, in collaboration with UK-based Clas-SiC Wafer Fab Ltd., will establish an integrated facility of Silicon Carbide (SiC) based Compound Semiconductors in Info Valley, Bhubaneshwar – which will be the first commercial compound fab in the country.
The project proposes to manufacture Silicon Carbide devices with an annual capacity of 60,000 wafers and a packaging capacity of 96 million units. The proposed products will have applications in missiles, defence equipment, electric vehicles (EVs), railway, fast chargers, data centre racks, consumer appliances, and solar power inverters.
3D Glass Solutions Inc. (3DGS) will set up a vertically integrated advanced packaging and embedded glass substrate unit in Info Valley, Bhubaneshwar, bringing the world’s most advanced packaging technology to India.
The facility will have a large variety of advanced technologies, including glass interposers with passives and silicon bridges, and 3D Heterogeneous Integration (3DHI) modules. Planned capacity of this unit will be approximately 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules per annum. The proposed products will have significant applications in defence, high-performance computing, artificial intelligence, RF and automotive, photonics and co-packaged optics, etc.
Advanced System in Package Technologies (ASIP) will set up a semiconductor manufacturing unit in Andhra Pradesh, in partnership with APACT Co. Ltd. of South Korea, with an annual capacity of 96 million units. The manufactured products will find applications in mobile phones, set-top boxes, automobile applications, and other electronic products.
Continental Device (CDIL) will expand its discrete semiconductor manufacturing facility at Mohali, Punjab. The proposed facility will manufacture high-power discrete semiconductor devices such as MOSFETs, IGBTs, Schottky Bypass Diodes, and transistors, both in Silicon and Silicon Carbide. The annual capacity of this brownfield expansion is expected to be 158.38 million units. The devices manufactured by these proposed units will have applications in automotive electronics, including EVs and their charging infrastructure, renewable energy systems, power conversion applications, industrial applications, and communication infrastructure.
Together, these projects will complement the country’s rapidly advancing chip design capabilities, which is backed by government support to 278 academic institutions and 72 start-ups through dedicated infrastructure programs. Already more than 60,000 students have availed the benefits of the talent development programme.
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