Govt. Launches Semicon 2.0 Portal, Announces 12 ECMS Approvals

The government has launched the Semicon 2.0 web application portal, inviting applications for three key areas of the semiconductor programme covering manufacturing equipment and materials, new fabrication facilities, and assembly, testing, marking and packaging (ATMP) and outsourced semiconductor assembly and test (OSAT) operations.

Union Minister for Electronics and Information Technology Ashwini Vaishnaw launched the portal and announced 12 additional approvals under the Electronics Components Manufacturing Scheme (ECMS), involving a projected investment of INR 7,503 crore.

The Semicon 2.0 programme has received a total outlay of INR 1.275 lakh crore, while cumulative approved investments under ECMS have now reached INR 77,051 crore.

The newly approved projects are expected to generate production worth INR 39,045 crore and create 7,127 direct employment opportunities. They cover 10 product segments, including electronic components, supply chain products and capital equipment, with manufacturing facilities spread across Gujarat, Karnataka, Madhya Pradesh, Maharashtra, Punjab, Tamil Nadu and Uttar Pradesh.

The Semicon 2.0 portal has been opened for applications under Pillar 2, covering machines and materials; Pillar 3, focusing on setting up additional semiconductor fabrication facilities; and Pillar 4, aimed at strengthening the ATMP/OSAT industry.

The Union Cabinet has approved an outlay of INR 1,27,500 crore for Semicon 2.0 under the India Semiconductor Mission (ISM). The programme has six strategic pillars covering chip design, machines and materials, semiconductor fabrication, ATMP/OSAT facilities, research and development, and talent development.

According to the government, the first phase of the Semicon India Programme resulted in the approval of 12 projects across six states, with cumulative investments exceeding INR 1.64 lakh crore. Five of these projects had commenced commercial production by October 2026.

The India Semiconductor Mission has also supported the development of semiconductor design capabilities. Under its initiatives, 105 startups have received access to electronic design automation (EDA) tools, 24 startups have received funding support and 15 have secured venture capital funding. Additionally, 332 institutions have been provided EDA tools under the Chips to Startup (C2S) Programme, through which 70,000 students have been trained.

Addressing the gathering, Vaishnaw said that India's electronics manufacturing sector was moving beyond assembly towards building a domestic value chain covering modules, components, materials and advanced technologies.

He highlighted the country's growing capabilities in battery cells, copper foils, copper-clad laminates and high-end printed circuit boards. He also said that government initiatives were creating opportunities for micro, small and medium enterprises (MSMEs), with nearly 50 percent of the units approved under ECMS belonging to this category.

Under Semicon 2.0, the government intends to strengthen domestic capabilities in semiconductor equipment, materials, chemicals and gases. Vaishnaw outlined a target of attracting at least three major equipment manufacturers and five companies in the chemicals and gases segments to India.

He also emphasised the need for stringent project selection, with technological capabilities, research and development, product quality and global competitiveness guiding investments in the semiconductor sector.

The latest 12 approvals follow the earlier approval of 106 applications involving investments of INR 69,548 crore. With the additional projects, the cumulative number of approved applications under ECMS has reached 118, covering 34 products across 16 states.

The total approved projects represent an expected investment of INR 77,051 crore, projected production of INR 5,73,146 crore and direct employment generation of 81,755 persons.

Among the component manufacturing projects, NeST ICELR Pvt. Ltd. has received approval for multi-layer printed circuit boards (PCBs), TDConnex (Chennai) Pvt. Ltd. for relays, Modern Automotives Ltd. for heat sinks and Voltix Semicon Pvt. Ltd. for specialty ceramics.

The supply chain approvals include copper foil manufacturing by Indo Asia Copper Ltd., anode material for lithium-ion cells by TACC Ltd. and cathode active material by Vidyuta Materials Pvt. Ltd. Enerfolie LLP has been approved for capacitor-grade polypropylene film, while Surface Modification Technologies Pvt. Ltd. will manufacture camera rims.

The approvals also cover capital equipment and associated manufacturing infrastructure. TDConnex (Chennai) Pvt. Ltd. will manufacture precision moulds and tooling, Rockwell Automation India Pvt. Ltd. will produce power and control systems for capital equipment, and Wipro Pari Robotics Pvt. Ltd. will manufacture factory automation and system integration equipment.

The latest approvals include first-time ECMS entries for copper foil, cathode active material and specialty ceramics, expanding the range of domestic manufacturing capabilities supported under the scheme.

Vaishnaw said that India's electronics manufacturing ecosystem was being developed to reduce import dependence and strengthen domestic production of computers and their components. He called for greater collaboration between industry stakeholders and continued investment in research, technology and manufacturing capabilities to position India as a globally competitive electronics and semiconductor manufacturing hub.