Energetica India Magazine March - April 2026

Cropping Monocrystalline silicon ingot Monocrystalline silicon short ingot Grinding Squaring Half-cutting It can simultaneously square and grind the ingot Using loop wire one-way rotary cutting. Efficiency is high, the cutting surface is clean and smooth. INTEGRATED SQUARER AND GRINDER INTEGRATED HALF-CUTTER & GRINDER Brick D. DEGUMMING F. WAFER INSPECTION 9-HEAD CROPPER Slicable brick/half brick It can simultaneously half cut and grind the ingot PROCESS DESCRIPTION OF SLICING PROCESS DESCRIPTION OF SHAPING B. GLUING C. SLICING E. CLEANING A. BRICK PREPARATION A C B D E F INGOT-TO-WAFER TURNKEY SOLUTIONS PIONEERING Bringing world-class 'Ingot-to-Wafer' expertise to India, Yujing combines high-efficiency machinery with sustainable automation and advanced consumables to power a brighter, greener solar future www.asteretech.com Aster e Technologies info@asteretech.com