BTU International, Inc., a leading supplier of advanced thermal processing equipment to the alternative energy and electronics manufacturing markets, announces that its TRITAN HV90 dual-lane metallization firing system exceeds industry standards for wafer breakage. The three-belt, three-speed system boasts a yield better than 99.99%, exceeding the industry standard for metallization firing.
“The HV90’s three-belt, TriSpeed system optimizes the thermal profile providing our customers a unique advantage to improve fill factor and cell efficiency,” said Bob Bouchard, product marketing manager for metallization products at BTU. “In an extensive field test comprised of over one year of full production, the TRITAN HV90 had a breakage rate of less than 0.01%, less than half of the industry standard of 0.02%.”
The TRITAN HV90 dual-lane metallization firing system features increased throughput at 3600 wafers per hour, an edge belt, volatile organic compound (VOC) abatement and a single zone spike with less than 3 seconds spike time. The TRITAN metallization firing system features BTU’s unique TriSpeed™ technology, allowing users to take advantage of superior ramp rates — up to 200ºC per second — while not compromising the drying and cooling sections of the profile. The three-belt, three-speed system provides revolutionary control of profile development. In trials, TRITAN has consistently shown an improvement in fill factor, resulting in increased efficiency.
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News published on 20 / 12 / 2011 by Andrew Callaway